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BEST offers the top quality BGA Inspection services using the most advanced working system and techniques. This Visual BGA inspection on all of the BGA joints using traditional methods is not possible as one cannot “see” each of the solder joints through direct visual observation. Here at BEST, our BGA X-ray Inspection system can help in the better in-depth analysis of BGAs. Void detection and percentage calculation, Pitch determination, Circularity of reflowed solder balls etc are the some BGA X-ray Inspection Capabilities. For more, visit us or call at 847-797-9250.
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